ADAU1860BCBZRLManufacturer: Analog Devices Inc.
ADAU1860BCBZRL
56-BUMP WAFER LEVEL CHIP SCALE P
Key Specifications
- Package
- 56-UFBGA, WLCSP
- Operating Temperature
- -40°C ~ 85°C
- Manufacturer
- Analog Devices Inc.
- Series
- -
- Packaging
- Tape & Reel (TR) || Cut Tape (CT) || Digi-Reel®
- Part Status
- Active
Stock3,651
3651 in stock
Indicative Price:$18.52
MOQ: 1 pcsLead Time: 10 Weeks days
100% AuthenticAll components sourced from authorized channels
Full TraceabilityComplete documentation and chain of custody
ISO 9001 CertifiedQuality management system certified
Response within 24 hours
Specifications
| Manufacturer | Analog Devices Inc. |
|---|---|
| Series | - |
| Packaging | Tape & Reel (TR) || Cut Tape (CT) || Digi-Reel® |
| Part Status | Active |
| Type | Audio |
| Data Interface | I2C, I2S, SPI |
| Resolution (Bits) | 24 b |
| Number of ADCs / DACs | 3 / 1 |
| Sigma Delta | No |
| S/N Ratio, ADCs / DACs (db) Typ | - |
| Dynamic Range, ADCs / DACs (db) Typ | 110 / 130 |
| Voltage - Supply, Analog | 1.7V ~ 1.98V |
| Voltage - Supply, Digital | 0.85V ~ 1.21V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package / Case | 56-UFBGA, WLCSP |
| Supplier Device Package | 56-WLCSP (2.98x2.68) |