R9A09G047E57GBG#BC1Manufacturer: Renesas Electronics Corporation
R9A09G047E57GBG#BC1
SOC:ASIC
Key Specifications
- Package
- 529-FBGA
- Operating Temperature
- -40°C ~ 125°C (TJ)
- Speed
- 1.8GHz
- Manufacturer
- Renesas Electronics Corporation
- Series
- RZ/G3E
- Packaging
- Tray
Stock1,000
1000 in stock
Indicative Price:$63.73
MOQ: 1 pcsLead Time: 14 Weeks days
100% AuthenticAll components sourced from authorized channels
Full TraceabilityComplete documentation and chain of custody
ISO 9001 CertifiedQuality management system certified
Response within 24 hours
Specifications
| Manufacturer | Renesas Electronics Corporation |
|---|---|
| Series | RZ/G3E |
| Packaging | Tray |
| Part Status | Active |
| Core Processor | ARM® Cortex®-A55 |
| Number of Cores/Bus Width | 4 Core, 64-Bit |
| Speed | 1.8GHz |
| Co-Processors/DSP | ARM® Cortex®-M33 |
| RAM Controllers | LPDDR4, LPDDR4x |
| Graphics Acceleration | No |
| Display & Interface Controllers | LCD, LVDS, MIPI-CSI2 |
| Ethernet | 10/100/1000Mbps (2) |
| SATA | - |
| USB | USB 2.0 (2), USB 3.2 (1) |
| Voltage - I/O | 1.2V, 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Grade | - |
| Qualification | - |
| Security Features | AES, ECC, SHA, TRNG |
| Mounting Type | Surface Mount |
| Package / Case | 529-FBGA |
| Supplier Device Package | 529-FBGA (15x15) |
| Additional Interfaces | CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, SCI |