SAM9X60-V/DWB-SL3Manufacturer: Microchip Technology
SAM9X60-V/DWB-SL3
ARM926 MPU, BGA, EXT. TEMP
Key Specifications
- Package
- 228-TFBGA
- Operating Temperature
- -40°C ~ 105°C (TA)
- Speed
- 600MHz
- Manufacturer
- Microchip Technology
- Series
- SAM9X60
- Packaging
- Tray
Stock1,000
1000 in stock
Contact for Price
MOQ: 1 pcs
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Specifications
| Manufacturer | Microchip Technology |
|---|---|
| Series | SAM9X60 |
| Packaging | Tray |
| Part Status | Active |
| Core Processor | ARM926EJ-S |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| Speed | 600MHz |
| Co-Processors/DSP | - |
| RAM Controllers | DDR2, LPDDR, LPSDR, SRAM |
| Graphics Acceleration | Yes |
| Display & Interface Controllers | Keyboard, LCD, Touchscreen |
| Ethernet | 10/100Mbps (2) |
| SATA | - |
| USB | USB 2.0 (5) |
| Voltage - I/O | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Grade | - |
| Qualification | - |
| Security Features | Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA |
| Mounting Type | Surface Mount |
| Package / Case | 228-TFBGA |
| Supplier Device Package | 228-TFBGA (11x11) |
| Additional Interfaces | CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART |