TDF8555J/N2-112ObsoleteManufacturer: NXP USA Inc.

TDF8555J/N2,112

IC AMPLIFIER DBS37P

Key Specifications

Package
37-SSIP Formed Leads
Operating Temperature
-40°C ~ 105°C (TA)
Manufacturer
NXP USA Inc.
Series
-
Packaging
Tube
Part Status
Obsolete

Stock1,000

1000 in stock

Contact for Price
MOQ: 1 pcs

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Specifications

Specifications
ManufacturerNXP USA Inc.
Series-
PackagingTube
Part StatusObsolete
TypeClass AB
Output Type4 Half Bridge
Max Output Power x Channels @ Load64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm
Voltage - Supply6V ~ 18V
Features-
Mounting TypeThrough Hole
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package37-PDBS
Package / Case37-SSIP Formed Leads