TDA3MDDBABFQ1Manufacturer: Texas Instruments
TDA3MDDBABFQ1
LOW POWER SOC W/ FULL-FEATURED P
Key Specifications
- Package
- 367-BFBGA, FCBGA
- Operating Temperature
- -40°C ~ 125°C (TJ)
- Speed
- 212.8MHz, 500MHz
- Manufacturer
- Texas Instruments
- Series
- -
- Packaging
- Tape & Reel (TR)
Stock1,000
1000 in stock
Contact for Price
MOQ: 1 pcs
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Specifications
| Manufacturer | Texas Instruments |
|---|---|
| Series | - |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Architecture | DSP, MPU |
| Core Processor | ARM® Cortex®-M4, C66x |
| Flash Size | - |
| RAM Size | 512kB |
| Peripherals | DMA, POR, PWM, WDT |
| Connectivity | CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB |
| Speed | 212.8MHz, 500MHz |
| Primary Attributes | - |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Package / Case | 367-BFBGA, FCBGA |
| Supplier Device Package | 367-FCBGA (15x15) |
| Number of I/O | 126 |