XCZU67DR-L1FSVE1156IManufacturer: AMD

XCZU67DR-L1FSVE1156I

IC ZUP RFSOC A53 FPGA LP 1156BGA

Key Specifications

Package
1156-BBGA, FCBGA
Operating Temperature
-40°C ~ 100°C (TJ)
Speed
500MHz, 1.2GHz
Manufacturer
AMD
Series
Zynq® UltraScale+™ RFSoC
Packaging
Tray

Stock1,000

1000 in stock

Indicative Price:$25,331.46
MOQ: 1 pcsLead Time: 52 Weeks days
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Specifications

Specifications
ManufacturerAMD
SeriesZynq® UltraScale+™ RFSoC
PackagingTray
Part StatusActive
ArchitectureMCU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size-
RAM Size256KB
Peripherals-
Connectivity-
Speed500MHz, 1.2GHz
Primary AttributesZynq® UltraScale+™ RFSoC
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1156-BBGA, FCBGA
Supplier Device Package1156-FCBGA (35x35)
Number of I/O-